2D, 3D+VSP acquisition geometries combining surface and downhole measurements

A.A. Tabakov; A.S. Kashik; G.N. Gogonenkov; K.V. Baranov

doi:10.3997/2214-4609-pdb.38.F272

2D, 3D+VSP acquisition geometries combining surface and downhole measurements
By A.A. Tabakov, A.S. Kashik, G.N. Gogonenkov and K.V. Baranov
Publisher: European Association of Geoscientists & Engineers
Source: Conference Proceedings, Geophysics of the 21st Century - The Leap into the Future, Sep 2003, cp-38-00138
DOI: https://doi.org/10.3997/2214-4609-pdb.38.F272

Abstract

Two applications of combined surface and downhole acquisition geometries are described. They are<br>called “2D+VSP” and “3D+VSP”. The advantages are based on the use of downhole arrival times and<br>signatures to improve surface seismic data. The case stories approve the proclaimed features of proposed<br>technology.

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2003-09-01

2024-04-20

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2D, 3D+VSP acquisition geometries combining surface and downhole measurements

Abstract

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