1887

Abstract

Two applications of combined surface and downhole acquisition geometries are described. They are<br>called “2D+VSP” and “3D+VSP”. The advantages are based on the use of downhole arrival times and<br>signatures to improve surface seismic data. The case stories approve the proclaimed features of proposed<br>technology.

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/content/papers/10.3997/2214-4609-pdb.38.F272
2003-09-01
2020-11-27
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http://instance.metastore.ingenta.com/content/papers/10.3997/2214-4609-pdb.38.F272
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